 produk> Substrat keramik> Substrat kipamik logam> Langsung Bond Tambaga DBC Keramik Substrat pikeun PCB

Langsung Bond Tambaga DBC Keramik Substrat pikeun PCB

Name: Langsung Bond Tambaga DBC Keramik Substrat pikeun PCB
Uploaded: 2020-12-01T22:16:06+08:00
Description: Langsung Bond Tambaga DBC Keramik Substrat pikeun PCB Dibikeun sipat transfer panas alus, tightness vakum sarta

$5
≥100 Set/Sets

ngahubungan Kiwari

Type pamayaran: T/T,Paypal,Western Union
Incoterm: FOB,CFR,CIF,EXW,FCA,CPT,CIP
Mnt. pesenan: 100 Set/Sets
kandaraan: Ocean,Land,Air
palabuhan: Shenzhen Port,Hongkong Port

Kamampuhan Suplai & Émbaran Tambahan

Additional Information

bungkusan: karton ékspor

kakuwatan keur ngasilkeun: 100,000 sets/month

kandaraan: Ocean,Land,Air

Tempat Asal: Cina

Kamampuhan suplai: 500,000 sets/month

Sertipikat: RoHS

palabuhan: Shenzhen Port,Hongkong Port

Type pamayaran: T/T,Paypal,Western Union

Incoterm: FOB,CFR,CIF,EXW,FCA,CPT,CIP

Atribut Produk

Model No.: Customized

merek: Jinghui keramik

Bungkusan & Pangiriman

Ngical Unit:	Set/Sets
Jenis Paket:	karton ékspor

Panjelasan Produk

Langsung Bond Tambaga DBC Keramik Substrat pikeun PCB Dibikeun sipat transfer panas alus, tightness vakum sarta lalawanan listrik minimum , alumina metallized keramik mangrupakeun komponén idéal pikeun vakum tinggi, tegangan tinggi jeung aplikasi tekanan tinggi. Ku nerapkeun palapis logam ipis (umum Mo / Bungbulang), ku lajeng handap ditutupan ku plating, kawas Nikel / Tambaga / Emas ... kana beungeut keramik,, las antara keramik jeung logam bisa dihontal, nu ogé katelah Metallization...

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Category: Substrat kipamik logam

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